Tachyum joins the UCIe community to promote integration into the package
LAS VEGAS, April 26, 2022 – Tachyum announced today that he has signed a letter of agreement to become a member of the Universal Chiplet Interconnect Express (UCIe) community to further develop and support the chip ecosystem and drive innovations on packaging.
UCIe is an open specification that defines the interconnect between chips within a package, enabling an open chip ecosystem and ubiquitous interconnect at the package level. UCIe members represent a wide range of industry expertise and include leaders in semiconductors, packaging, IP providers, foundries and cloud services.
The UCIe 1.0 specification is an open industry standard developed to establish pervasive interconnection at the package level and covers the die-to-die I/O physical layer, die-to-die protocols, and software stack that take advantage of the Well-established PCI. Industry standards Express (PCIe) and Compute Express Link (CXL). Specification is available upon request.
Tachyum plans to use mature chip-to-chip technology for its Prodigy 2 processor at the 3nm level. Multi-die connectivity will play a vital role in both significantly increasing the performance of Prodigy 2, as well as increasing the range of performance points and applications for which Prodigy 2 would be used.
“I’ve dedicated much of my career to helping overcome the limitations of Moore’s Law by developing technologies that enable smaller, more energy-efficient designs,” said Dr. Radoslav Danilak, Founder and CEO of Tachyum. “By joining UCIe and integrating Prodigy into its emerging chip ecosystem, we are creating a system that allows the best and proven components from multiple vendors to be mixed and matched to accelerate adoption. We are delighted to be among the UCIe members behind the integration within the package.
Prodigy has the potential to create unparalleled computing speed and vast power-saving capabilities for large-scale, OEM, telecommunications, private cloud, and government markets. Prodigy’s 10x lower CPU core power consumption will significantly reduce carbon emissions associated with data center usage. Prodigy’s 3x lower cost (at equivalent performance) will also translate into billions of dollars in annual savings for hyperscalers like Google, Facebook, Amazon and Alibaba.
Tachyum’s Prodigy processor can run HPC, convolutional AI, explainable AI, general AI, bio AI, and edge neural network applications, as well as normal data center workloads, on a single homogeneous processor platform, using existing standard programming models. Without Prodigy, hyperscale data centers must use a disparate mix of CPU, GPU, and TPU hardware for these different workloads, creating inefficiency, expense, and the complexity of separate provisioning and maintenance infrastructures. Using specific hardware dedicated to each type of workload (e.g. data center, AI, HPC) results in underutilization of hardware resources and more difficult programming, support, and maintenance. Prodigy’s ability to switch seamlessly between these different workloads is dramatically changing the competitive landscape and data center economics.
Tachyum is transforming the AI, HPC, and public and private cloud data center markets with Prodigy, the world’s first universal processor that delivers industry-leading performance, cost, and power efficiency for purpose and purpose computing general. When Prodigy processors are delivered in a large-scale data center, they enable all AI, HPC, and general-purpose applications to run on hardware infrastructure, saving businesses billions of dollars. dollars per year. A fully functional Prodigy emulation system is currently available to select customers and partners for early testing and software development. With data centers currently consuming more than 3% of the planet’s electricity, up from 10% by 2025, the ultra-low-power Prodigy Universal Processor is essential if we are to continue doubling global data center capacity every four years. Tachyum, co-founded by Dr. Radoslav Danilak with its flagship product Prodigy, is heading for tape release and chip sampling in 2022, with software emulations and an FPGA-based emulator running native Linux available for early adopters . The company is building the world’s fastest 64 exaflops AI supercomputer in 2022 in the EU with Prodigy chips. Tachyum has offices in the United States and Slovakia. For more information, visit https://www.tachyum.com.